
Our services:
Surface Mount Technology (SMT)
Through Hole Technology (THT)
Ball Grid Array(BGA)/0201 chips assembly
Cable assembly & Wire harness
Mix-Techonlogy assembly and box-building
Lead-Free & RoHS compliance, halogen-free
Conventional / mixed technology assembly
High-mixed/Low and MID-volume support
Full / part procurement, alliance with global suppliers
Test in-house(ICT/FT High-pot/ E-test etc)
NPI: Fast prototyping
Design for manufactruign/test(DFM/DFT)
Good communication in English language
As your choice, we will be your win-win partner for PCB assembly and Cable assembly supporting.